Abstract: Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.

Abstract: A cookware assembly includes an open-top vessel with diametrically opposed handles and diametrically opposed pour spouts, and a lid including an outer peripheral frame member, a central member spaced from the frame member and support structure coupled to each of the frame member and the central member closing the space therebetween. A flange depends from the frame member and has a plurality of vertically elongated apertures therethrough adjacent to a predetermined location on the frame which carries indicia to indicate the location of the apertures.

Abstract: Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.

Abstract: A thin film surface-mountable fuse for protection against electrical overload. The fuse comprises a substrate, fusible link, a containment compound, and a pair of terminal pads. The fusible link is produced from a first conductive material and supported on the substrate. A diffusion bar of a second conductive material is deposited on a portion of the fusible link. The containment compound is also deposited over a portion of the fusible link. The containment compound inhibits migration of the diffusion bar along the fusible link during an electrical overload. The terminal pads are electrically connected to the fusible link and also supported by the substrate.