Patents by Inventor Eiji Nakamura
Eiji Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12269107Abstract: Removal of substrates in a composite substrate is facilitated, and flaking of the composite substrate in an unintended process is prevented. A method for manufacturing a composite substrate includes: forming a first bonding material in a first surface of a first substrate; forming, in the first surface, at least one groove located more inward than a periphery in a plan view of the first substrate; forming the first bonding material along an inner wall of the at least one groove, the first bonding material not filling into space enclosed by the inner wall of the at least one groove; forming a second bonding material on a second surface of a second substrate; and bonding the first bonding material and the second bonding material together in a region except the at least one groove.Type: GrantFiled: June 21, 2019Date of Patent: April 8, 2025Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kunihiko Nishimura, Keisuke Nakamura, Masahiro Fujikawa, Shuichi Hiza, Tomohiro Shinagawa, Eiji Yagyu
-
Patent number: 12263004Abstract: A cognitive function determination method includes applying a load including a sensory stimulus (5a) or tasks with different degrees of difficulty a plurality of times (S1), measuring a change in brain activity of a subject (P) when the load is applied and acquiring measurement data (S2), and determining a degree of cognitive function of the subject (P) (S3).Type: GrantFiled: July 7, 2017Date of Patent: April 1, 2025Assignees: SHIMADZU CORPORATION, Medical Corporation Sochikai, MCBI INC.Inventors: Satoshi Yomota, Shin Nakamura, Eiji Ando, Takashi Asada, Hiroko Nakata, Kazuhiko Uchida, Yoshinori Nishimura
-
Patent number: 12064817Abstract: A surface coated cutting tool includes a tool substrate; and a hard coating layer on the tool substrate. The hard coating layer includes, in sequence from the tool substrate toward a surface of the tool, a titanium carbonitride inner layer, a titanium nitride lower intermediate layer, a titanium carbonitride upper intermediate layer, a titanium oxycarbonitride bonding auxiliary layer, and an aluminum oxide outer layer. Titanium nitride grain boundaries in the lower intermediate layer and titanium carbonitride grain boundaries in the upper intermediate layer are continuous from titanium carbonitride grain boundaries in the inner layer. The texture coefficient TC(422) of titanium carbonitride in the inner layer and the upper intermediate layer is 3.0 or more, and the texture coefficient TC(0 0 12) of ?-aluminum oxide in the outer layer is 5.0 or more.Type: GrantFiled: June 5, 2020Date of Patent: August 20, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Eiji Nakamura, Mitsuhiro Abe, Kazuhiro Kawano
-
Patent number: 11969828Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.Type: GrantFiled: April 6, 2023Date of Patent: April 30, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
-
Publication number: 20240064402Abstract: The technology relates to an imaging apparatus, an imaging control method, and a program for resuming tracking from an appropriate position at an end of tracking. The imaging apparatus includes a focus control section configured to control a tracking function of tracking a tracking target and keeping the tracking target in focus, and a setting section configured to move a tracking start position during tracking on the basis of a predetermined condition. The technology may be applied, for example, to the imaging apparatus having the tracking function.Type: ApplicationFiled: December 28, 2021Publication date: February 22, 2024Inventors: Takahiro Sato, Yu Kimishima, Yohei Takada, Takayuki Hosokawa, Akira Fukuda, Eiji Nakamura, Terutoshi Nakagawa, Makoto Kurahashi, Akiko Yoshimoto
-
Patent number: 11720801Abstract: A technique for performing a function by utilizing chemical reactions is disclosed. In the technique, solution including an input chemical species having a concentration is provided. A chemical reaction network that includes at least a sequence of chemical reactions starting with the input chemical species to generate a plurality of output chemical species is also prepared. The solution is exposed to the chemical reaction network to present a pattern formed by the plurality of output chemical species depending on the concentration of the input chemical species.Type: GrantFiled: August 25, 2020Date of Patent: August 8, 2023Assignee: International Business Machines CorporationInventors: Eiji Nakamura, Toshiyuki Yamane, Koji Masuda
-
Publication number: 20230241700Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.Type: ApplicationFiled: April 6, 2023Publication date: August 3, 2023Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
-
Patent number: 11684988Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.Type: GrantFiled: March 9, 2022Date of Patent: June 27, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
-
Patent number: 11660026Abstract: Embodiments are disclosed for a method for restoring a wearable biological sensor. The method includes determining that a wearable biological marker sensor comprising a reference electrode is placed within a restoration apparatus. The restoration apparatus includes a correct reference electrode, a counter electrode, and a chloride solution. The reference electrode is in electrical contact with the correct reference electrode and the counter electrode through the chloride solution. The method additionally includes determining whether the reference electrode is degraded based on a voltage differential between the reference electrode and the correct reference electrode. The method also includes restoring the reference electrode, if the reference electrode is degraded, by applying a voltage to a circuit. The circuit includes the reference electrode and the counter electrode. Further, multiple chloride ions of the chloride solution bond with a plurality of silver atoms of the reference electrode.Type: GrantFiled: November 20, 2019Date of Patent: May 30, 2023Assignee: International Business Machines CorporationInventors: Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch, Hiroyuki Mori
-
Publication number: 20230105932Abstract: A surface coated cutting tool includes a tool substrate; and a hard coating layer on the tool substrate. The hard coating layer includes, in sequence from the tool substrate toward a surface of the tool, a titanium carbonitride inner layer, a titanium nitride lower intermediate layer, a titanium carbonitride upper intermediate layer, a titanium oxycarbonitride bonding auxiliary layer, and an aluminum oxide outer layer. Titanium nitride grain boundaries in the lower intermediate layer and titanium carbonitride grain boundaries in the upper intermediate layer are continuous from titanium carbonitride grain boundaries in the inner layer. The texture coefficient TC(422) of titanium carbonitride in the inner layer and the upper intermediate layer is 3.0 or more, and the texture coefficient TC(0 0 12) of ?-aluminum oxide in the outer layer is 5.0 or more.Type: ApplicationFiled: June 5, 2020Publication date: April 6, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Eiji Nakamura, Mitsuhiro Abe, Kazuhiro Kawano
-
Publication number: 20220193805Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
-
Patent number: 11329018Abstract: A technique for fabricating a bump structure is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared, in which the pads includes first conductive material. A metallic adhesion layer is coated on each pad. A bump base is formed on each pad by sintering conductive particles using a mold layer, in which the conductive particles includes second conductive material different from the first conductive material.Type: GrantFiled: October 23, 2019Date of Patent: May 10, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Takashi Hisada, Toyohiro Aoki, Eiji Nakamura
-
Patent number: 11298769Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.Type: GrantFiled: May 13, 2019Date of Patent: April 12, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
-
Publication number: 20220064700Abstract: A technique for performing a function by utilizing chemical reactions is disclosed. In the technique, solution including an input chemical species having a concentration is provided. A chemical reaction network that includes at least a sequence of chemical reactions starting with the input chemical species to generate a plurality of output chemical species is also prepared. The solution is exposed to the chemical reaction network to present a pattern formed by the plurality of output chemical species depending on the concentration of the input chemical species.Type: ApplicationFiled: August 25, 2020Publication date: March 3, 2022Inventors: Eiji Nakamura, Toshiyuki Yamane, Koji Masuda
-
Patent number: 11181704Abstract: A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.Type: GrantFiled: January 16, 2020Date of Patent: November 23, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Masao Tokunari
-
Patent number: 11164845Abstract: A method for fabricating a resist structure is presented. The method includes preparing a substrate on which plural conductive pads are formed; and patterning a lower resist to form plural lower cavities. The lower resist is deposited above the substrate. Each of the plural lower cavities are located above a corresponding one of the plural conductive pads. Additionally, the method includes patterning an upper resist to form plural upper cavities. The upper resist is deposited on the lower resist. Each of the plural upper cavities are located on a corresponding one of the plural lower cavities and have a diameter larger than a diameter of the corresponding one of the plural lower cavities.Type: GrantFiled: January 30, 2020Date of Patent: November 2, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eiji Nakamura, Toyohiro Aoki, Takashi Hisada, Risa Miyazawa
-
Patent number: 11112570Abstract: A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.Type: GrantFiled: January 16, 2020Date of Patent: September 7, 2021Assignee: International Business Machines CorporationInventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Masao Tokunari
-
Publication number: 20210263384Abstract: This display apparatus comprises: a plurality of pixels arrayed along a plurality of rows and a plurality of columns; a plurality of signal lines connected to the plurality of pixels respectively for each row; a drive circuit for generating a plurality of control signals to selectively turn the plurality of pixels on and off by rows, the drive circuit applying the control signals to the signal lines; a power supply circuit for supplying the drive circuit with a voltage for generating each control signal; and at least one inductor connected between the power supply circuit and the plurality of signal lines.Type: ApplicationFiled: June 29, 2018Publication date: August 26, 2021Inventor: EIJI NAKAMURA
-
Publication number: 20210242164Abstract: A method for fabricating a resist structure is presented. The method includes preparing a substrate on which plural conductive pads are formed; and patterning a lower resist to form plural lower cavities. The lower resist is deposited above the substrate. Each of the plural lower cavities are located above a corresponding one of the plural conductive pads. Additionally, the method includes patterning an upper resist to form plural upper cavities. The upper resist is deposited on the lower resist. Each of the plural upper cavities are located on a corresponding one of the plural lower cavities and have a diameter larger than a diameter of the corresponding one of the plural lower cavities.Type: ApplicationFiled: January 30, 2020Publication date: August 5, 2021Inventors: Eiji Nakamura, Toyohiro Aoki, Takashi Hisada, Risa Miyazawa
-
Publication number: 20210145325Abstract: Embodiments are disclosed for a method for restoring a wearable biological sensor. The method includes determining that a wearable biological marker sensor comprising a reference electrode is placed within a restoration apparatus. The restoration apparatus includes a correct reference electrode, a counter electrode, and a chloride solution. The reference electrode is in electrical contact with the correct reference electrode and the counter electrode through the chloride solution. The method additionally includes determining whether the reference electrode is degraded based on a voltage differential between the reference electrode and the correct reference electrode. The method also includes restoring the reference electrode, if the reference electrode is degraded, by applying a voltage to a circuit. The circuit includes the reference electrode and the counter electrode. Further, multiple chloride ions of the chloride solution bond with a plurality of silver atoms of the reference electrode.Type: ApplicationFiled: November 20, 2019Publication date: May 20, 2021Inventors: Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch, HIROYUKI MORI