Abstract: An acoustic wave device, and an acoustic wave filter and electronics module including the same. The acoustic wave device comprises a first interdigital transducer electrode having a first bus bar and a first plurality of electrode fingers extending from the first bus bar, the first bus bar having a width of 3 ?m or less in a direction parallel to the extension of the first plurality of electrode fingers, and a second interdigital transducer electrode having a second bus bar and a second plurality of electrode fingers extending from the second bus bar and interleaved with the first plurality of electrode fingers, the second bus bar having a width of 3 ?m or less in a direction parallel to the extension of the second plurality of electrode fingers. The acoustic wave device allows for improvements in power durability when used in an acoustic wave filter, without an increase in size of the acoustic wave filter.

Abstract: In at least one embodiment, a method for operating a receiver includes configuring a receiver front-end circuit of the receiver according to a selected power consumption configuration. The method includes adjusting a quiescent current of a programmable flat gain stage coupled to the receiver front-end circuit according to the selected power consumption configuration to compensate for any gain loss of the receiver front-end circuit in the selected power consumption configuration. The selected power consumption configuration may be a reduced power consumption configuration and the programmable flat gain stage may be configured to at least partially compensate for the gain loss of the receiver front-end circuit in the reduced power consumption configuration.

Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

Abstract: Architectures and techniques relate to selectively implementing certain components to filter emissions. For example, a circuit can include a filter associated with a first frequency range, a first switch, and a second switch. The first switch can be configured to, in a filter state, route a signal through the filter and configured to, in a bypass state, route the signal to an output node while bypassing the filter. The second switch can be configured to, in the filter state, route the signal from the filter to the output node.

Abstract: Embodiments of this disclosure relate to reducing coupling between acoustic wave resonators. An isolation region of a substrate can be located between acoustic wave resonators. The isolation region can reduce capacitive coupling through the substrate between the acoustic wave resonators. In certain embodiments, the isolation region can be located between acoustic wave resonators of different filters to thereby increase isolation between the filters.

Abstract: A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Abstract: A filter with bulk acoustic wave devices is disclosed. The filter includes a first bulk acoustic wave resonator and a second bulk acoustic wave resonator. The first bulk acoustic wave resonator includes a first raised frame structure. The first raised frame structure is a multi-layer raised frame structure. The second bulk acoustic wave resonator includes a second raised frame structure. The first raised frame structure has at least one more raised frame layer than the second raised frame structure.

Abstract: An acoustic wave device, a method of manufacture of the same, and a radio frequency filter including the same. The acoustic wave device comprises a multilayer piezoelectric substrate (MPS) including a layer of piezoelectric material having a lower surface disposed on an upper surface of a layer of a dielectric material having a lower surface disposed on an upper surface of a carrier substrate. An interdigital transducer (IDT) is disposed on the multilayer piezoelectric substrate and includes an active region configured to generate an acoustic wave. First and second high impedance portions are included within the multilayer piezoelectric substrate, the first and second high impedance portions each positioned outside the active region of the interdigital transducer and extending in the direction of propagation of the acoustic wave to be generated by the interdigital transducer. The first and second high impedance portions reduce side leakage and suppress transverse modes.

Abstract: An acoustic wave device comprises a piezoelectric substrate, interdigital transducer electrodes having an electrode pitch ?0, and first and second reflector gratings disposed on opposite respective sides of the interdigital transducer electrodes in a propagation direction of a main acoustic wave through the acoustic wave device, the first reflector grating having a reflector electrode pitch ?1 throughout an entirety of the first reflector grating that is different than a reflector electrode pitch ?2 throughout an entirety of the second reflector grating to suppress ripples in a conductance curve of the acoustic wave device.

Abstract: Dispersive delay lines are disclosed. The dispersive delay line can include a piezoelectric substrate having a first interdigital transducer electrode on a first region of the piezoelectric substrate and a second interdigital transducer electrode on a second region of the piezoelectric substrate. The dispersive delay line is arranged such that an acoustic wave is configured to propagate from the first interdigital transducer electrode to the second interdigital transducer electrode though a third region of the piezoelectric substrate. An additional material positioned on the third region of the piezoelectric substrate can impact acoustic wave propagation velocity. Related radio frequency modules, wireless communications devices, and methods are disclosed.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: An isolation capacitor structure reduces the likelihood of breakdown in the passivation layers by physically re-shaping or dividing the top plate of the isolation capacitor into two segments. In that way, the electric field is driven down and away from the passivation surfaces. One embodiment utilizes a series capacitor formed by the top metal plate of the capacitor and an additional “top hat” plate above the top metal plate that redirects the fields into the main isolation capacitor. Vias may be included between the top hat plate and the top metal plate. Another approach reshapes the top plate to have an integrated top hat structure and achieves similar results of directing charge down and away from the passivation layer surface breakdown paths.

Abstract: A calibration operation determines a resistance of a sense resistor in a POE system. A voltage measurement is taken with a first current flowing through the sense resistor. A second voltage measurement is taken with a second current flowing through the resistor. A resistance value of the sense resistor is determined based on a voltage difference between the first and second voltage measurements and a current difference between the first current and the second currents.

Abstract: An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.

Abstract: Aspects of this disclosure relate to an acoustic wave device having an overtone mode as a main mode. The acoustic wave device is sufficiently asymmetric on opposing sides of a piezoelectric layer over an acoustic reflector such that the main mode of the acoustic wave device is the overtone mode.

Abstract: A printed circuit board for use in an electronics package has a die attach pad and one or more adhesion strips outside the die attach pad. The adhesion strip(s) facilitate adhesion of a mold compound over the die attach pad and die and inhibits (e.g., prevents) delamination of the mold compound from the die attach pad.

Abstract: Disclosed herein are switching or other active FET configurations that implement a branch design with one or more interior FETs of a main path coupled in parallel with one or more auxiliary FETs of an auxiliary path. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of auxiliary FETs coupled in series and a main FET coupled in parallel with an interior FET of the plurality of auxiliary FETs. The body nodes of the FETs can be interconnected and/or connected to a body bias network. The body nodes of the FETs can be connected to body bias networks to enable individual body bias voltages to be used for individual or groups of FETs.

Abstract: A delay measurement circuit includes a first skew circuit disposed proximate to a first bonding pad configured to receive a first clock signal having a first frequency. The delay measurement circuit includes a second skew circuit disposed proximate to a second bonding pad configured to receive a second clock signal having a second frequency. The first and second skew circuits each have a first mode of operation as zero-delay-return path and a second mode of operation as a synchronized pass path. The delay measurement circuit includes a pair of conductive traces coupled to the first skew circuit, another pair of conductive traces coupled to the second skew circuit, a time-to-digital converter circuit, and a switch circuit configured to selectively couple the time-to-digital converter circuit to the first skew circuit via the pair of conductive traces and the second skew circuit via the other pair of conductive traces.

Abstract: Radio frequency front-end systems with filter reuse. In certain embodiments, a front-end system includes a filter, a low noise amplifier (LNA), and a switch interposed between the filter and an input to the LNA. In a first state of the switch, the filter serves to filter a radio frequency signal that is amplified by the LNA. The front-end system further includes a power amplifier that is coupled to the switch. Additionally, in a second state of the switch, the filter serves to filter an amplified radio frequency transmit signal provided by the power amplifier. Accordingly, a filter along a receive path of the front-end system is reused for transmit.

Abstract: Aspects of this disclosure relate to a multiplexer with an acoustic assisted trap circuit. The multiplexer includes a first acoustic wave filter and a second acoustic wave filter. The first acoustic wave filter can include a bulk acoustic wave resonator. The second acoustic wave filter can include a surface acoustic wave resonator and an impedance network. The surface acoustic wave resonator and the impedance network can together provide a trap for a harmonic associated with the first acoustic wave filter.